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Anritsu Highlights RF & Signal Integrity Testing at Embedded World 2026
Advanced RF, power consumption and high-speed signal-integrity solutions enable reliable IoT device validation from wireless connectivity to PCIe Gen6 compliance.
www.anritsu.com

In IoT devices, embedded systems, data centers and high-speed communication equipment, product reliability increasingly depends on early and continuous RF and signal integrity validation. At Embedded World 2026 in Nuremberg (March 10–12), Anritsu Corporation will demonstrate how structured testing across the entire development cycle helps manufacturers avoid certification failures, redesigns and field performance issues.
Located in Hall 4, Booth 4-450, Anritsu will present application-driven demonstrations covering Wi-Fi®, Bluetooth®, RedCap and high-speed signal-integrity testing. The focus is on identifying performance limitations early, quantifying their real-world impact and improving time to compliance.
Wi-Fi RF validation for next-generation IoT devices
With evolving IEEE 802.11 standards across the 2.4 GHz, 5 GHz and 6 GHz bands, validating RF transmit and receive characteristics is essential for stable wireless performance. Anritsu will showcase the MT8862A Wireless Connectivity Test Set, designed to measure RF TRx performance of WLAN devices supporting 802.11a/b/g/n/ac/ax/be.
The demonstration highlights how device faults can be detected and quantified during development and production. Accurate RF data enables manufacturers to optimize throughput, reduce retransmissions and ensure certification readiness before formal approval testing.
Bluetooth® performance analysis under real-world conditions
Bluetooth connectivity in embedded and consumer IoT products requires stable RF performance under varying environmental and interference conditions. Anritsu will demonstrate real-time RF performance measurement and analysis, showing how early-stage validation improves link reliability and reduces troubleshooting cycles.
The setup illustrates how measurement-driven optimization enhances device stability in applications such as wearables, industrial sensors and smart home devices.
RedCap power consumption in 5G IoT environments
Power efficiency remains a critical design parameter in cellular IoT devices. Anritsu will demonstrate RedCap device power consumption under varying signal strength, bandwidth and modulation conditions within an emulated 5G network.
The demonstration shows how accurate power profiling supports optimization of battery lifetime and verification of power-saving mechanisms such as eDRX. Controlled and repeatable testing environments help prevent costly redesigns by identifying inefficiencies early in development.
High-speed signal integrity and PCIe Gen6 compliance
In data center and embedded computing architectures, signal integrity validation of PAM4 and high-speed differential interfaces is essential. In collaboration with Teledyne LeCroy, Anritsu will demonstrate a multi-standard test solution supporting Ethernet and PCIe Gen6 compliance.
The integrated workflow combines the Anritsu MP1900A Signal Quality Analyzer with the Teledyne LeCroy WaveMaster/SDA 8650HD Oscilloscope, enabling high-quality PAM4 signal generation and real-time analysis. Automated stressed-signal calibration aligned with PCI-SIG requirements, using QualiPhy2 software, demonstrates how automation improves repeatability and reduces time to compliance.
Broadband differential interconnect validation
Modern high-performance computing and data center systems rely on accurate characterization of high-speed differential interconnects. Anritsu will showcase the ShockLine MS46524B VNA, a 4-port broadband solution operating up to 43.5 GHz.
Using a GigaProbes differential demo board, visitors will observe evaluation of insertion loss, return loss and crosstalk. Integrated de-embedding and fixture extraction tools enable precise measurement of backplanes, cables, connectors and SERDES interconnects without external software, simplifying validation workflows.
At Embedded World 2026, Anritsu’s demonstrations illustrate how comprehensive RF testing, power measurement and signal integrity analysis form the foundation of reliable IoT devices and high-speed embedded systems. By integrating measurement early in the development cycle, manufacturers can improve product robustness while accelerating certification and market introduction.
www.anritsu.com

