Intel-based edge platforms for industrial AI deployment

At embedded world 2026, 10 – 12.3.2026 in Nuremberg, SECO will present a broad portfolio of Intel-based edge computing solutions designed to support real-world AI workloads across industrial and embedded applications, from automation and machine vision to intelligent HMIs and gateways.

Edge computing platforms for AI-driven industrial systems
As industrial systems increasingly require local data processing, low latency, and AI acceleration at the edge, SECO’s hardware portfolio addresses a wide range of performance, power, and environmental requirements. The company’s solutions combine long-term availability, standardised form factors, and tight integration with software tools to support scalable and maintainable industrial architectures.

A central highlight is the SOM-COMe-BT6-PTL, a COM Express Type 6 Basic module based on Intel Core Ultra Series 3 processors. The module integrates up to 16 CPU cores alongside Intel NPU 5, delivering up to 50 TOPS of dedicated AI performance and up to 180 TOPS of combined AI throughput when CPU, GPU, and NPU resources are used together. Integrated Intel Arc graphics with Xe3 architecture support advanced imaging and visual workloads, while interfaces such as DDR5/LPDDR5x memory, PCIe Gen4/Gen5, Thunderbolt, and multi-display outputs enable deployment in AI-driven automation, multi-camera systems, medical imaging, smart retail, and latency-sensitive edge scenarios.

Designed within the COM Express Type 6 ecosystem, the module provides a scalable foundation for long-life industrial and mission-critical systems without locking designs to proprietary architectures.

Software-defined automation demonstrated at the edge
At the SECO booth, the platform is demonstrated through a software-defined industrial automation setup developed with Reply. The live system shows how data from PLCs can be collected, standardised, and analysed directly at the edge to generate operational insights in real time. Local AI processing enables predictive maintenance, fault analysis, and decision support without dependency on cloud connectivity, illustrating how industrial equipment can evolve into adaptive, data-driven assets.

Scalable COM Express portfolio based on Intel Atom platforms
Complementing the high-performance Core Ultra offering, SECO will also present a range of COM Express Type 6 Basic modules built on Intel Atom x7000 Series and Intel Processor N-series platforms. Modules such as SOM-COMe-CT6-ASL, SOM-COMe-CT6-TWL, and SOM-COMe-CT6-ADL-N share a common hardware and software foundation, allowing system designers to scale across power and performance profiles.

Configurations range from dual-core designs with TDPs as low as 6 W to octa-core solutions, with selected variants supporting extended industrial temperature ranges. This modular approach supports applications in factory automation, smart infrastructure, retail systems, and embedded HMIs, while reducing redesign effort across product families.

For early-stage evaluation and development, SECO also provides limited starter kits based on selected COM Express configurations, including an entry-level setup using the SOM-COMe-CT6-ADL-N.

Compact Pico-ITX systems for space-constrained designs
For applications that require a fully integrated, system-ready solution, SECO will showcase its Pico-ITX single-board computers based on Intel Atom x7000 Series and Intel Processor N-series. Models such as SBC-pITX-TWL, SBC-pITX-ASL, and SBC-pITX-ADL-N integrate CPU, memory, and industrial I/O into a compact 100 × 72 mm form factor.

These fanless-capable boards target space-constrained and cost-optimised designs, including industrial controllers, gateways, embedded HMIs, and compact edge devices, while maintaining long-term availability and support for industrial operating conditions.

Modular Vision HMI for industrial environments
SECO will also present Modular Vision, its industrial HMI platform based on Intel Atom x7000RE processors, available in 10.1-inch and 15.6-inch variants. Designed for continuous industrial operation, the platform features an IP66-rated front panel for panel-mount installations, wide DC input, and regulatory compliance for global deployment.

Both display sizes use projected capacitive touch technology, chemically strengthened glass, and high-brightness panels suitable for industrial control and monitoring. The modular architecture allows consistent integration with SECO’s software ecosystem across automation, energy, vending, smart infrastructure, and edge AI applications.

Integrated software ecosystem for deployment and lifecycle management
All showcased hardware platforms are supported by SECO’s software ecosystem, including tools for device management, data orchestration, and AI enablement. The SECO Application Hub provides access to pre-integrated AI and machine learning applications, while the SECO Developer Center centralises technical documentation, development tools, and design resources. Together, these elements aim to reduce integration complexity and accelerate the deployment of scalable industrial edge solutions.

www.edge.seco.com