Innovative functionality available with Mentor’s Analog FastSPICE platform can dramatically accelerate nanometer-scale verification of large, post-layout analog designs.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will expand its XENSIV 3D magnetic sensor family TLx493D. At its in-house digital trade show "Virtual Sensor Experience", the chipmaker will present a new device for industrial and consumer applications: the TLI493D-W2BW.
Murata Manufacturing Co., Ltd. (Head Office: Nagaokakyo City, Kyoto Prefecture, Japan; hereinafter “Murata”) has completed compatibility verification of the MCU*1 embedded Bluetooth® Module (MBN52832) (hereinafter “the Murata Module”) with VitaNet Suite, the secure IoT platform that VitaNet, Inc. (Head Office: California, USA; hereinafter "VitaNet") will begin offering in July 2020.
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched “TB9120AFTG,” a constant-current 2-phase stepping motor driver for automotive applications. The new IC outputs a sine-wave current using only a simple clock input interface, with no need for an advanced functional MCU or dedicated software.
BittWare, a Molex company, the leading supplier of enterprise-class NVMe computational storage products featuring FPGA technology, today announces the launch of the 250-M2D Accelerator Module.