12
'21
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E+E ELEKTRONIK News
12
'21
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Actia News
AUTO DIAGNOSTICS HOTLINE: AN EXPERT MULTI-MAKE TECHNICIAN ON THE LINE
ACTIA is boosting the volume capacities of its diagnostics hotline. This support service is aimed at all customers of Multi-Diag, ACTIA’s multi-make diagnostics and repair tool. This community represents around 13,000 customers. They include independent garage owners of course, but also technicians in major multi-make networks that are Multi-Diag customers such as: Midas, Feu Vert, Euromaster, Autodistribution, ERCS, etc.
12
'21
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Vox Power News
300W output modules for industrial applications added to Vox Power’s NEVO+ series modular power supply range
Vox Power has introduced two new 300W output modules for use with their NEVO+600 and NEVO+1200 series modular power supplies.
12
'21
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Mouser News
Mouser Electronics Named 2020 NPI Partner of the Year by Digi
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, is pleased to announce that it has been named 2020 New Product Introduction (NPI) Partner of the Year by Digi International, a leading global provider of Internet of Things (IoT) connectivity products and services.
12
'21
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Panduit News
Panduit Launches 400G Next Generation CS® Connector to Optimize Data Center Fiber to Rack Density
As bandwidth speeds continue to increase, 200G/400G applications are becoming commonplace in high performance data center environments, requiring enhanced capabilities at the rack level. Panduit has launched the CS®Connector, a high-density fiber connector solution that optimizes the data center for next generation applications.
12
'21
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Intel News
INTEL LAUNCHES NEW 11TH GEN CORE FOR MOBILE
Intel delivers industry-leading mobile performance with 11th Gen Intel Core mobile H-series and Intel Xeon W-11000 series.
11
'21
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IDS Imaging Development Systems GmbH
Vial check
Intelligent multi-camera system for quality control of vaccine bottles
11
'21
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Adlinktech News
ADLINK Releases Industry-first Embedded MXM Graphics Modules on NVIDIA Turing Architecture
Embedded MXM graphics modules based on Turing architecture for edge AI.
11
'21
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CEVA News
CEVA to Acquire Intrinsix Corp., Expanding its Offering to Include Full Turnkey IP Platforms
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that it agreed to acquire Massachusetts-based Intrinsix Corp., a leading chip design specialist, for approximately $33 million in cash, subject to working capital and other customary purchase price adjustments. The closing of the acquisition is anticipated to take place during the second quarter of 2021.
11
'21
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Actemium News
