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Anritsu News

Anritsu, in Collaboration with Qualcomm, Verifies Industry First Enhanced Network Slicing and Power Saving Tests for 5G New Radio Standalone

Anritsu Corporation is pleased to announce that the first enhanced Network Slicing and User Equipment (UE) power saving Protocol Conformance Tests for 5G New Radio (NR) Standalone (SA) have been verified on the 5G NR Mobile Device Test Platform ME7834NR powered by the Snapdragon® X65 5G Modem-RF System, the world’s first Release 16 modem-RF system.

TDK News

HDD Heads: TDK reports successfully shipped prototype HDD-Heads with next generation recording technology, MAS-MAMR

TDK Corporation (TSE:6762) announces that it has successfully shipped prototype heads with next generation recording technology, MAS-MAMR, which is co-developed with Toshiba Corporate R&D Center and Toshiba Electric Devices & Storage Corporation.

Infineon News

Infineon and Deeyook jointly enable precise location solution with low-power Wi-Fi chipset

The location-as-a-service (LaaS) company has invented and patented an award-winning tracking solution to determine indoor and outdoor locations of items, assets, and employees. Both companies fuse Deeyook’s ultra-precise, innovative algorithms into Infineon’s best-in-class, low power AIROC Wi-Fi® portfolio to enable an accurate, passive, ubiquitous, and efficient location solution.

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