TDK Corporation announces the introduction of 15kW and 22.5kW scalable power systems to the TDK-Lambda GENESYS+ series of high-power density programmable DC power supplies.
Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.
The industrial camera manufacturer IDS Imaging Development Systems GmbH from Obersulm feels responsible for keeping its ecological footprint as small as possible.
The new product provides double the capacity of 16Gb modules within the same package size, enabling 128GB DRAM module production without the TSV process, and decreasing power consumption by 10%.
Sivers Semiconductors has received an initial order from Vector Photonics for the evaluation of epitaxial material for a new, next-generation surface coupling laser project.