29 {{ "2024-04-29T00:00:00+00:00" | date "MMM" }} '24

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Leuze

Leuze: New Ultrasonic sensors

Thanks to an adjustable sound cone and small dead zone, the new Leuze ultrasonic sensors of the 420B and 412B series can be used for many different applications.

Read more…

26 {{ "2024-04-26T00:00:00+00:00" | date "MMM" }} '24

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ANSYS News

Ansys and TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chips.

Read more…

26 {{ "2024-04-26T00:00:00+00:00" | date "MMM" }} '24

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Panasonic Industry News

Higher efficiency and mirror-like black surface: Panasonic Industry introduces new Amorton indoor solar cell series

Amorton can harvest energy reliably and sustainably even in low light and artificial light environments.

Read more…

26 {{ "2024-04-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-26T00:00:00+00:00" | date "longDate" }}

Microchip News

maXTouch^® Touchscreen Controller Family Expands with Additional Security Features for Touchscreen Payment Systems

Microchip’s ATMXT2952TD 2.0 family of touch controllers offer cryptographic authentication and data encryption.

Read more…

26 {{ "2024-04-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-26T00:00:00+00:00" | date "longDate" }}

innodisk

Innodisk Unveils Groundbreaking MIPI over Type-C Solution for Enhanced AI Vision Applications

Innodisk announces the launch of its industry’s first MIPI over Type-C solution. This exclusive technology overcomes traditional MIPI cable length limitations, allowing embedded camera modules to be positioned farther from the system.

Read more…

26 {{ "2024-04-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-26T00:00:00+00:00" | date "longDate" }}

CEA Leti News

CEA-Leti Selected to Coordinate Two EU Projects for Developing ‘First-Class’ 6G Capabilities

CEA-Leti has been chosen to coordinate two projects to help build first-class 6G technology capabilities and boost standardization efforts across Europe.

Read more…

26 {{ "2024-04-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-26T00:00:00+00:00" | date "longDate" }}

TDK News

TDK OFFERS SNAP-IN CAPACITORS WITH INCREASED COMPACTNESS FOR GENERAL-PURPOSE APPLICATIONS

These RoHS-compliant aluminium electrolytic capacitors can be used in a wide range of applications.

Read more…

26 {{ "2024-04-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-26T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

KEYSIGHT, SYNOPSYS, AND ANSYS DELIVER RADIO FREQUENCY DESIGN MIGRATION FLOW TO TSMC’S N6RF+ PROCESS NODE

New flow provides an efficient, integrated radio frequency circuit re-design solution based on Synopsys Custom Design Family, Keysight Electromagnetic Simulation, and Ansys Device Synthesis.

Read more…

26 {{ "2024-04-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-26T00:00:00+00:00" | date "longDate" }}

Diodes Incorporated News

Self-Adapting USB 2.0 Signal Conditioner IC from Diodes Incorporated Saves Power and Simplifies System Design

Diodes Incorporated announces the introduction of the PI5USB212, a USB 2.0 signal conditioner that operates from a supply voltage down to 2.3V.

Read more…

26 {{ "2024-04-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-04-26T00:00:00+00:00" | date "longDate" }}

Rutronik Info

Tiny, fully shielded SMD power inductors: The new T-series from knitter-inductive - new at Rutronik

The new ICSIxxxxxxTxSHyST12 series from knitter-inductive expands the Rutronik portfolio of SMD power inductors.

Read more…

White Paper

Delta Electronics: Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

Leuze: New Ultrasonic sensors

Thanks to an adjustable sound cone and small dead zone, the new Leuze ultrasonic sensors of the 420B and 412B series can be used for many different applications.

Ansys and TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chips.

Higher efficiency and mirror-like black surface: Panasonic Industry introduces new Amorton indoor solar cell series

Amorton can harvest energy reliably and sustainably even in low light and artificial light environments.

maXTouch^® Touchscreen Controller Family Expands with Additional Security Features for Touchscreen Payment Systems

Microchip’s ATMXT2952TD 2.0 family of touch controllers offer cryptographic authentication and data encryption.

Innodisk Unveils Groundbreaking MIPI over Type-C Solution for Enhanced AI Vision Applications

Innodisk announces the launch of its industry’s first MIPI over Type-C solution. This exclusive technology overcomes traditional MIPI cable length limitations, allowing embedded camera modules to be positioned farther from the system.

CEA-Leti Selected to Coordinate Two EU Projects for Developing ‘First-Class’ 6G Capabilities

CEA-Leti has been chosen to coordinate two projects to help build first-class 6G technology capabilities and boost standardization efforts across Europe.

TDK OFFERS SNAP-IN CAPACITORS WITH INCREASED COMPACTNESS FOR GENERAL-PURPOSE APPLICATIONS

These RoHS-compliant aluminium electrolytic capacitors can be used in a wide range of applications.

KEYSIGHT, SYNOPSYS, AND ANSYS DELIVER RADIO FREQUENCY DESIGN MIGRATION FLOW TO TSMC’S N6RF+ PROCESS NODE

New flow provides an efficient, integrated radio frequency circuit re-design solution based on Synopsys Custom Design Family, Keysight Electromagnetic Simulation, and Ansys Device Synthesis.

Self-Adapting USB 2.0 Signal Conditioner IC from Diodes Incorporated Saves Power and Simplifies System Design

Diodes Incorporated announces the introduction of the PI5USB212, a USB 2.0 signal conditioner that operates from a supply voltage down to 2.3V.

Tiny, fully shielded SMD power inductors: The new T-series from knitter-inductive - new at Rutronik

The new ICSIxxxxxxTxSHyST12 series from knitter-inductive expands the Rutronik portfolio of SMD power inductors.

International