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Power and Data Connectivity Systems for Autonomous Device Infrastructure
The HARTING Technology Group introduces integrated interface components designed to reduce design debt and support increased power transmission in robotic applications.
www.harting.com
Han®-MPC-PCB-Version
The HARTING Technology Group is releasing new printed circuit board (PCB) versions of its Han Miniature Power Connector (MPC) and detailing its NVIDIA MGX ecosystem cooperation for artificial intelligence data centers. These integrated solutions address the escalating power and signal transmission demands of artificial intelligence hardware across robotics, semiconductor manufacturing, and industrial automation.
Interface Optimization in Industrial Automation and Robotics
The integration of artificial intelligence into humanoid robots and unmanned aerial vehicles (UAVs) requires specialized interfaces for power, data, and signal transmission. Kurt Robert Hippler, VP Global Business Area Device at HARTING, notes that distributing AI capabilities into industrial machines fundamentally increases the electrical demands placed on infrastructure equipment. Early technical decisions regarding interface selection impact all Design for Excellence (DfX) dimensions, determining a device's long-term manufacturability, testability, and serviceability. According to Rodriques Johnpeter, Global Market Segment Manager, choosing standardized industrial-grade connectors during the prototyping stage effectively mitigates subsequent design debt before series production begins.
PCB Connectors for High-Current Autonomous Applications
At electronica 2026 (November 10 to 13 in Munich, Hall A3, Stand 103), HARTING will debut printed circuit board variations of the Han MPC. Engineered for autonomous mobility applications where size, weight, and power (SWaP) remain primary engineering constraints, the connector system consolidates high current-carrying capacity with a single mating interface for both power and signals. To further accelerate prototyping and lower production risks, developers can utilize the har-modular PCB connector system, based on DIN 41612 standards, to configure modular units starting from a single piece using automated digital design files. Additionally, HARTING utilizes 3D MID (Mechatronic Integrated Device) technology to embed complex electronic circuits directly into three-dimensional structural components.
MPC-PCB-Connector
Power Distribution for Data Centers and Edge Sensor Networks
Beyond autonomous robotics, power distribution architectures are scaling to accommodate high-density computing loads in core network facilities. In response, HARTING has integrated into the NVIDIA MGX ecosystem to provide specialized power connectivity hardware for AI data centers. At the field-device level, the company is advancing Single Pair Ethernet (SPE) protocols to transmit sensor data to cloud environments over a single wire pair. This network architecture, which Kurt Robert Hippler will detail at the Electrical Connectors Forum (November 11, Hall A5), minimizes physical footprint and reduces cabling costs within the digital supply chain. To support uninterrupted global sourcing for these systems, the company maintains redundant production facilities and vertically integrated manufacturing capabilities, which are concurrently highlighted at the co-located SEMICON Europa tradeshow.
Additional Context
This section details technical specifications and competitive benchmarking not included in the original news release.
The Han Miniature Power Connector (MPC) operates within a temperature range of -40°C to +90°C and supports up to 500 mating cycles at an IP40 protection rating. The MPC series includes models capable of delivering 30 A and 60 A at 120 VDC, specifically targeting the strict space requirements of unmanned aerial vehicles and mobile robotics. In competitive benchmarking, comparable compact high-power modular systems designed for space-constrained industrial systems—such as offerings from Molex (AirBorn SInergy) and TE Connectivity—typically maximize their continuous current ratings at approximately 25 A per contact or module bay. By offering 30 A to 60 A capacities within a comparable miniature footprint featuring a single mating face, the Han MPC yields a significantly higher current density for AI-driven mobile hardware. Furthermore, the broader connector market increasingly relies on optimizing these localized interfaces to improve the overarching Power Usage Effectiveness (PUE) of both edge robotics and centralized AI data centers.
Edited by Aishwarya Mambet, Induportals Editor, with AI assistance.
www.harting.com
The HARTING Technology Group is releasing new printed circuit board (PCB) versions of its Han Miniature Power Connector (MPC) and detailing its NVIDIA MGX ecosystem cooperation for artificial intelligence data centers. These integrated solutions address the escalating power and signal transmission demands of artificial intelligence hardware across robotics, semiconductor manufacturing, and industrial automation.
Interface Optimization in Industrial Automation and Robotics
The integration of artificial intelligence into humanoid robots and unmanned aerial vehicles (UAVs) requires specialized interfaces for power, data, and signal transmission. Kurt Robert Hippler, VP Global Business Area Device at HARTING, notes that distributing AI capabilities into industrial machines fundamentally increases the electrical demands placed on infrastructure equipment. Early technical decisions regarding interface selection impact all Design for Excellence (DfX) dimensions, determining a device's long-term manufacturability, testability, and serviceability. According to Rodriques Johnpeter, Global Market Segment Manager, choosing standardized industrial-grade connectors during the prototyping stage effectively mitigates subsequent design debt before series production begins.
PCB Connectors for High-Current Autonomous Applications
At electronica 2026 (November 10 to 13 in Munich, Hall A3, Stand 103), HARTING will debut printed circuit board variations of the Han MPC. Engineered for autonomous mobility applications where size, weight, and power (SWaP) remain primary engineering constraints, the connector system consolidates high current-carrying capacity with a single mating interface for both power and signals. To further accelerate prototyping and lower production risks, developers can utilize the har-modular PCB connector system, based on DIN 41612 standards, to configure modular units starting from a single piece using automated digital design files. Additionally, HARTING utilizes 3D MID (Mechatronic Integrated Device) technology to embed complex electronic circuits directly into three-dimensional structural components.
MPC-PCB-Connector
Power Distribution for Data Centers and Edge Sensor Networks
Beyond autonomous robotics, power distribution architectures are scaling to accommodate high-density computing loads in core network facilities. In response, HARTING has integrated into the NVIDIA MGX ecosystem to provide specialized power connectivity hardware for AI data centers. At the field-device level, the company is advancing Single Pair Ethernet (SPE) protocols to transmit sensor data to cloud environments over a single wire pair. This network architecture, which Kurt Robert Hippler will detail at the Electrical Connectors Forum (November 11, Hall A5), minimizes physical footprint and reduces cabling costs within the digital supply chain. To support uninterrupted global sourcing for these systems, the company maintains redundant production facilities and vertically integrated manufacturing capabilities, which are concurrently highlighted at the co-located SEMICON Europa tradeshow.
Additional Context
This section details technical specifications and competitive benchmarking not included in the original news release.
The Han Miniature Power Connector (MPC) operates within a temperature range of -40°C to +90°C and supports up to 500 mating cycles at an IP40 protection rating. The MPC series includes models capable of delivering 30 A and 60 A at 120 VDC, specifically targeting the strict space requirements of unmanned aerial vehicles and mobile robotics. In competitive benchmarking, comparable compact high-power modular systems designed for space-constrained industrial systems—such as offerings from Molex (AirBorn SInergy) and TE Connectivity—typically maximize their continuous current ratings at approximately 25 A per contact or module bay. By offering 30 A to 60 A capacities within a comparable miniature footprint featuring a single mating face, the Han MPC yields a significantly higher current density for AI-driven mobile hardware. Furthermore, the broader connector market increasingly relies on optimizing these localized interfaces to improve the overarching Power Usage Effectiveness (PUE) of both edge robotics and centralized AI data centers.
Edited by Aishwarya Mambet, Induportals Editor, with AI assistance.
www.harting.com
