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Molex Expands RF Test Connectivity to 145 GHz
New multi-port coaxial assemblies address high-frequency characterization needs in AI hardware validation and future wireless research environments.
www.molex.com

High-frequency validation has become a bottleneck for next-generation computing and wireless hardware, where signal characterization must extend into millimeter-wave and emerging terahertz bands. In this context, Molex introduced Cardinal Multi-Port High-Frequency Coaxial Assemblies supporting measurements up to 145 GHz.
Extending measurement bandwidth beyond the 110 GHz ceiling
For RF test and measurement systems, 110 GHz has commonly marked the upper range of widely deployable coaxial interfaces. The shift toward 6G research, high-speed backhaul, and large AI clusters requires verification of higher-frequency silicon and interconnect behavior.
The new assemblies provide phase-matched connections designed for minimal insertion loss and improved return loss at extreme frequencies. They enable data characterization up to 448 Gbps, allowing validation of devices operating in:
- AI accelerator interconnects
- 5G and early 6G radio hardware
- satellite communication payload electronics
- millimeter-wave radar
- terahertz imaging instrumentation
The expansion effectively allows engineers to test future-generation components without changing the broader lab infrastructure, supporting continuity in the digital supply chain of hardware validation.
Multi-channel routing in dense test setups
Modern evaluation platforms increasingly require simultaneous measurement across multiple RF paths, for example during phased-array antenna calibration or high-lane-count serializer/deserializer validation.
The Cardinal multi-port housing consolidates several RF connectors into a single interface, enabling high-density parallel testing within a compact footprint. Compression-mounted, solderless PCB attachment simplifies installation and reduces rework time, while also lowering total cost of ownership by shortening setup cycles.
Integration with the existing Cardinal ecosystem allows migration from 110 GHz to 145 GHz capability without redesigning fixtures or adapters.
Repeatability for frequent connection cycles
Test environments routinely mate and unmate connectors hundreds of times during characterization campaigns. Measurement reliability depends on maintaining stable electrical performance throughout those cycles.
The assemblies are rated for more than 500 mating cycles, with precision connector alignment intended to maintain consistent measurements across repeated tests. The high-density PCB interface also reduces board area requirements, enabling smaller evaluation boards and potentially lower prototyping costs.
By extending coaxial measurement capability to 145 GHz while supporting 448 Gbps characterization, the assemblies address verification challenges emerging in the automotive data ecosystem, high-performance computing hardware, and next-generation wireless research.
www.molex.com
Multi-channel routing in dense test setups
Modern evaluation platforms increasingly require simultaneous measurement across multiple RF paths, for example during phased-array antenna calibration or high-lane-count serializer/deserializer validation.
The Cardinal multi-port housing consolidates several RF connectors into a single interface, enabling high-density parallel testing within a compact footprint. Compression-mounted, solderless PCB attachment simplifies installation and reduces rework time, while also lowering total cost of ownership by shortening setup cycles.
Integration with the existing Cardinal ecosystem allows migration from 110 GHz to 145 GHz capability without redesigning fixtures or adapters.
Repeatability for frequent connection cycles
Test environments routinely mate and unmate connectors hundreds of times during characterization campaigns. Measurement reliability depends on maintaining stable electrical performance throughout those cycles.
The assemblies are rated for more than 500 mating cycles, with precision connector alignment intended to maintain consistent measurements across repeated tests. The high-density PCB interface also reduces board area requirements, enabling smaller evaluation boards and potentially lower prototyping costs.
By extending coaxial measurement capability to 145 GHz while supporting 448 Gbps characterization, the assemblies address verification challenges emerging in the automotive data ecosystem, high-performance computing hardware, and next-generation wireless research.
www.molex.com

