Compact SiC MOSFETs Deliver Superior Thermal and Power Performance
ROHM introduces low-profile SiC MOSFETs in TOLL packages engineered to enhance thermal efficiency and power density in compact industrial and energy systems.
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How compact industrial and energy systems benefit from high-efficiency TOLL-package SiC MOSFETs
Advanced power systems such as AI servers, energy storage platforms and compact PV inverters increasingly require components that support higher power density while enabling smaller, low-profile product designs. As power demands rise, particularly in slim totem-pole PFC architectures where semiconductor thickness must remain below 4 mm, developers face pressure to combine high power handling with reduced thermal resistance and footprint.
Improved thermal capability and reduced size
To address these constraints, ROHM began mass production of its SCT40xxDLL SiC MOSFET series in the TOLL (TO-Leadless) package. Compared with conventional TO-263-7L devices of similar voltage ratings and on-resistance, the new package achieves roughly 39 percent better thermal performance. This improvement enables stable high-power operation in applications where heat dissipation limits system efficiency, supporting higher power density designs without increasing component height.
The TOLL structure also reduces the footprint by approximately 26 percent and achieves a 2.3 mm low-profile thickness, nearly half that of conventional packaged products. These characteristics make the series suitable for compact server power supplies, ESS units and space-restricted power electronics where system height and PCB area are critical.
Higher voltage capability for robust system performance
Unlike most TOLL-package devices limited to 650 V, the ROHM series supports drain-source ratings up to 750 V. This higher voltage margin enables the use of lower gate resistance, improves surge handling capability and reduces switching losses. These electrical advantages are particularly relevant in high-efficiency, high-frequency architectures used in energy-dense server power designs and next-generation renewable energy converters.
Product availability and design support
The lineup includes six models with on-resistance values ranging from 13 mΩ to 65 mΩ, with mass production initiated in September 2025. The devices are available through major distributors including DigiKey, Mouser and Farnell. ROHM also provides simulation models for all six products on its official website to support rapid evaluation during circuit development.
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