Toshiba Electronics Europe GmbH (“Toshiba”) has leveraged its technological expertise in wide bandgap (WBC) semiconductor processes to introduce a compact but effective MOSFET module.

TOKYO—Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the “TCR5RG series” of 45 LDO regulators, all housed in a thin, compact WCSP4F package. The industry-leading[1] high ripple rejection ratio[2] of the new LDO regulators bring enhanced power stabilization to DC power lines for mobile devices, such as wearables. Volume shipments start today.

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched “MG800FXF2YMS3,” a silicon carbide (SiC) MOSFET module integrating newly developed dual channel SiC MOSFET chips with ratings of 3300V and 800A, for industrial applications. Volume production will start in May 2021.

3rd-generation 9-disk Helium-sealed design and innovations in energy-assisted recording help customers achieve new levels of storage density and power efficiency.

100V rated device in compact DIP4 package covers wide control range.

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched "TLP241B," a high-current photorelay in a DIP4 package for industrial equipment such as programmable logic controllers and I/O interfaces. Samples and production quantities are available now.

Breaks the limitations of classical mechanics by introducing a quasi-quantum effect Expected to accelerate complex problem-solving in finance, pharmaceuticals and logistics.

TOKYO—Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added a new eFuse IC, “TCKE712BNL,” to its line-up of eFuse ICs for repeated use that support functions to protect power line circuits.

Featuring adjustable over-voltage protection plus flagging capabilities.

Innovative design enables microcontroller port reduction via daisy-chain connection function.