Siemens is collaborating with TSMC on certifications and innovative design solutions at the OIP Forum, accelerating 3D IC and AI-driven circuit and systems design for mutual customers using TSMC's advanced process technologies.

Siemens Digital Industries Software and UMC collaborate to enhance chip design reliability using Siemens' mPower software for advanced EM and IR drop analysis.

Siemens EDA introduces Innovator3D IC suite and Calibre 3DStress software, addressing complex 2.5D/3D IC designs to enhance design, yield, and reliability.

Siemens integrates generative and agentic AI across its EDA portfolio, enhancing productivity and accelerating chip/PCB design and verification through NVIDIA microservices.

These certifications cover Samsung's FinFET and MBCFET processes (14nm-2nm), enabling customers to confidently use Siemens' Calibre, Solido, and Aprisa software for next-gen semiconductor design.

New PADS Pro Essentials and Xpedition Standard software offer SMBs professional, AI-powered, collaborative PCB design, accelerating cycles and reducing risk.

Collaboration enhances Open Innovation Platform, accelerating semiconductor design with cutting-edge tools, boosting efficiency, and enabling next-gen chip technologies for future applications.

For the first time, high-fidelity thermal simulation data can be shared in the electronic supply chain while protecting semiconductor OEM’s intellectual property.

Collaboration between Siemens, sureCore and Semiwise to develop cryogenic semiconductor designs capable of operating in extreme cold conditions required for quantum computing.

Siemens Digital Industries Software today announced that Samsung Foundry’s advanced 3nm process technology now supports Siemens’ entire Calibre^® nmPlatform tool, which is the industry’s leading solution for physical verification of next-generation integrated circuits (ICs).