08
'21
Written on
Rohm Semiconductors News
07
'21
Written on
Datalogic News
DATALOGIC BRINGS SOLUTIONS FOR EVERY TRACEABILITY APPLICATION TO PACK EXPO 2021
Datalogic, a global leader in the automatic data capture and factory automation markets, is pleased to announce its participation at PACK EXPO 2021 in Las Vegas, with an extensive booth displaying traceability solutions for every application.
07
'21
Written on
TDK News
Development of an Image Diagnosis Technology Utilizing a High-Sensitivity Magnetic Sensor
Yokohama National University, a national university corporation (Yokohama-city, Kanagawa pref. President: Izuru Umehara, hereinafter “YNU”) and TDK Corporation (Tokyo, President: Shigenao Ishiguro, hereinafter “TDK”) have developed a prototype image diagnosis technology utilizing a high-sensitivity magnetic sensor*.
07
'21
Written on
ST News
STMicroelectronics Announces Mass-Market Availability of ST4SIM GSMA-compliant eSIMs for M2M Applications
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced mass-market availability of its ST4SIM, eSIM (embedded SIM) ICs for Machine-to-Machine (M2M) applications through e-distribution.
06
'21
Written on
Anritsu News
Anritsu Introduces Broadband VNA System with Single-sweep Coverage Up to 125 GHz With Guaranteed and Typical Specifications
VectorStar ME7838AX/EX Have Best-in-Class Performance Over Widest Frequency Sweep to Give Engineers Greater Confidence in mmWave Designs.
06
'21
Written on
Mouser News
New eBook from Mouser Electronics and Amphenol Explores the Interconnects, Sensors, and Antennas Required for IIoT
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a new eBook in collaboration with Amphenol Corporation, highlighting the many applications of the Industrial Internet of Things (IIoT) as well as the technical challenges in developing IIoT solutions.
06
'21
Written on
Infineon News
Flexibility meets increased power density and performance: Infineon enhances 1200 V EconoDUAL 3 portfolio with IGBT7 featuring new current ratings
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new current ratings for its EconoDUAL 3 portfolio with TRENCHSTOP IGBT7 chips. With the broad range of current classes from 300 A up to 900 A, the portfolio offers inverter designers a high degree of flexibility while also providing increased power density and performance. In addition to solar and drive applications, the portfolio is also tailored for commercial, construction and agricultural vehicles (CAV) as well as for uninterruptible power supply (UPS) inverters.
06
'21
Written on
ARC INFORMATIQUE
Monitoring the charging stations of the e-bus fleet of the city of Jena
The charging infrastructure always in view.
06
'21
Written on
Keysight technologies News
Keysight and MediaTek Achieve Milestone in 6Gbps Data Throughput Performance with 5G Sub-6 3CC 300 MHz CA Connectivity
Collaboration enables mobile operators to efficiently deploy advanced 5G services in standalone mode.
06
'21
Written on
Intel News
