Infineon Technologies AG is presenting the SECORA ID with FIDO® for secured authentication to online portals with user-friendly tokens. The leading security solution actively protects from tampering and fraud.
The new eBook highlights the diverse challenges and solutions in RF wireless design. A panel of 8 Experts on RF Wireless Design, industry leaders from Analog Devices and other innovative technology companies offer insightful analyses of some of the most common difficulties in RF applications.
We provide a wide range of thermal products, including the best and highly effective fans and various cooling modules and liquid cooling systems. SUNON aims to satisfy 5G applications' needs: high speed and non-stop transmission.
Southco has expanded its line of VISE ACTION® Compression Latches with a new covered version that allows the operator to identify whether the latch is open or closed.
Kontron, a leading global provider of IoT/embedded computer technology (ECT), is expanding its portfolio of industrial motherboards with the D3714-V/R mSTX. This is Kontron's first completely new motherboard development following the acquisition of Fujitsu's industrial motherboard division. The new product in the space-saving mini-STX format supports up to four independent displays in 4K resolution. This makes it suitable for applications such as digital signage, kiosks, medical displays, thin clients and ultra-small industrial PCs. A matching SMARTCASE for universal use is available for the two D3714-R versions in the form of the S511 housing kit.
METZ CONNECT has already been offering patch cords with MPO/MTP® connectors for several years. MPO/MTP® connectors are mainly used in data centers at transmission rates of e.g. 40 or 400 GBit/s. They are used to connect distribution technology, e.g. 19" panels, and active components such as servers or switches.
With the development of its SenSWIR sensors, Sony has laid a milestone for the future expansion of SWIR imaging: Thanks to the cutting-edge InGaAs sensor architecture, images in both the visible and invisible short-wave infrared light spectrum can be captured simultaneously for the first time. At the same time, the sensors set new standards in terms of pixel size and image homogeneity.