01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

Icana News

Picocom and iCana collaborate on 5G Open RAN small cell reference platform

Picocom has announced a strategic partnership to jointly develop a 5G Open RAN Small Cell radio unit reference platform, enabling customers to quickly and cost-effectively bring their products to market.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Electronics added over 15,000 new parts in the first quarter of 2023

Mouser Electronics is focused on introducing new products and technologies to provide customers with an advantage.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Electronics Shines Spotlight on Green Energy Storage Systems in Season Launch of Empowering Innovation Together

Mouser the industry's leading (NPI) distributor with the widest selection of semiconductors and electronic components, kicks off an enlightening new season of the award-winning Empowering Innovation Together (EIT) content series on green energy storage, days before Earth Day 2023.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM’s New Ultra-Low Profile 12W Rated Metal Plate Shunt Resistor: Ideal for Double-Sided Cooled Power Modules in Automotive and Industrial Equipment Applications

0.2Milliohm (PSR100) and 15W class (PSR330) variants in the industry’s smallest* size are also being commercialized.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

Infineon News

New EiceDRIVER 1200 V half-bridge driver IC family with active Miller clamp for optimized ruggedness in high power systems

Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

TDK News

TDK TO SHOWCASE LATEST INNOVATIONS AT SENSOR+TEST AND PCIM

Sensor+Test and PCIM take place from May 9 to 11 in parallel in the Exhibition Center Nuremberg, Germany. TDK is represented at Sensor+Test at booth 204 in hall 1 and at PCIM at booth 348 in hall 9.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

ANSYS News

TSMC CERTIFIES ANSYS MULTIPHYSICS SOLUTIONS FOR N2 SILICON PROCESS

Ansys is certified for TSMC’s N2 process, including thermal self-heat effects for greater chip reliability and more optimized designs.

Read more…

28 {{ "2023-04-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-28T00:00:00+00:00" | date "longDate" }}

Rutronik Info

Base for high-end-computing: New Intel^® Xeon^® W-3400 and Intel^® Xeon^® W-2400 processor family at Rutronik

With the Intel^® Xeon^® W-3400 and W-2400 (code-named Sapphire Rapids), Rutronik Elektronische Bauelemente GmbH is adding new desktop workstation processors to its range that are predestined for high-end computing.

Read more…

28 {{ "2023-04-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-28T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon Technologies AG and Schweizer Electronic AG (ETR: SCE) are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC).

Read more…

28 {{ "2023-04-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-28T00:00:00+00:00" | date "longDate" }}

Nexperia News

NEXPERIA INTRODUCES THE BEST-IN-CLASS PORTFOLIO OF I2C GPIO EXPANDERS

The portfolio provides an elegant solution when additional I/Os are needed while keeping the interconnections to a minimum.

Read more…

White Paper

Delta Electronics: Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

Picocom and iCana collaborate on 5G Open RAN small cell reference platform

Picocom has announced a strategic partnership to jointly develop a 5G Open RAN Small Cell radio unit reference platform, enabling customers to quickly and cost-effectively bring their products to market.

Mouser Electronics added over 15,000 new parts in the first quarter of 2023

Mouser Electronics is focused on introducing new products and technologies to provide customers with an advantage.

Mouser Electronics Shines Spotlight on Green Energy Storage Systems in Season Launch of Empowering Innovation Together

Mouser the industry's leading (NPI) distributor with the widest selection of semiconductors and electronic components, kicks off an enlightening new season of the award-winning Empowering Innovation Together (EIT) content series on green energy storage, days before Earth Day 2023.

ROHM’s New Ultra-Low Profile 12W Rated Metal Plate Shunt Resistor: Ideal for Double-Sided Cooled Power Modules in Automotive and Industrial Equipment Applications

0.2Milliohm (PSR100) and 15W class (PSR330) variants in the industry’s smallest* size are also being commercialized.

New EiceDRIVER 1200 V half-bridge driver IC family with active Miller clamp for optimized ruggedness in high power systems

Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family.

TDK TO SHOWCASE LATEST INNOVATIONS AT SENSOR+TEST AND PCIM

Sensor+Test and PCIM take place from May 9 to 11 in parallel in the Exhibition Center Nuremberg, Germany. TDK is represented at Sensor+Test at booth 204 in hall 1 and at PCIM at booth 348 in hall 9.

TSMC CERTIFIES ANSYS MULTIPHYSICS SOLUTIONS FOR N2 SILICON PROCESS

Ansys is certified for TSMC’s N2 process, including thermal self-heat effects for greater chip reliability and more optimized designs.

Base for high-end-computing: New Intel^® Xeon^® W-3400 and Intel^® Xeon^® W-2400 processor family at Rutronik

With the Intel^® Xeon^® W-3400 and W-2400 (code-named Sapphire Rapids), Rutronik Elektronische Bauelemente GmbH is adding new desktop workstation processors to its range that are predestined for high-end computing.

Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon Technologies AG and Schweizer Electronic AG (ETR: SCE) are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC).

NEXPERIA INTRODUCES THE BEST-IN-CLASS PORTFOLIO OF I2C GPIO EXPANDERS

The portfolio provides an elegant solution when additional I/Os are needed while keeping the interconnections to a minimum.

International

White Paper

Picocom has announced a strategic partnership to jointly develop a 5G Open RAN Small Cell radio unit reference platform, enabling customers to quickly and cost-effectively bring their products to market.

Mouser Electronics is focused on introducing new products and technologies to provide customers with an advantage.

Mouser the industry's leading (NPI) distributor with the widest selection of semiconductors and electronic components, kicks off an enlightening new season of the award-winning Empowering Innovation Together (EIT) content series on green energy storage, days before Earth Day 2023.

0.2Milliohm (PSR100) and 15W class (PSR330) variants in the industry’s smallest* size are also being commercialized.

Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family.

Sensor+Test and PCIM take place from May 9 to 11 in parallel in the Exhibition Center Nuremberg, Germany. TDK is represented at Sensor+Test at booth 204 in hall 1 and at PCIM at booth 348 in hall 9.

Ansys is certified for TSMC’s N2 process, including thermal self-heat effects for greater chip reliability and more optimized designs.

With the Intel® Xeon® W-3400 and W-2400 (code-named Sapphire Rapids), Rutronik Elektronische Bauelemente GmbH is adding new desktop workstation processors to its range that are predestined for high-end computing.

Infineon Technologies AG and Schweizer Electronic AG (ETR: SCE) are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC).

The portfolio provides an elegant solution when additional I/Os are needed while keeping the interconnections to a minimum.

International

With the Intel^® Xeon^® W-3400 and W-2400 (code-named Sapphire Rapids), Rutronik Elektronische Bauelemente GmbH is adding new desktop workstation processors to its range that are predestined for high-end computing.