Infineon Technologies AG, based in Germany, is a global leader in semiconductor solutions with core expertise in power systems, automotive electronics, and IoT applications. Its portfolio includes microcontrollers, sensors, and power semiconductors, enabling smarter and safer electronics. Infineon supports energy-efficient mobility, smart buildings, and secure communications. Committed to sustainability, Infineon plays a central role in shaping green technology through innovation and advanced chip design across multiple industries.
Infineon Technologies LLC, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, today announced its next-generation 144-Mb Quad Data Rate II+ (QDR ®-II+) SRAM that is certified to the DLA Qualified Manufacturers List Class V (QML-V).
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy.
Power switches based on the wide bandgap (WBG) material gallium nitride (GaN) enable excellent efficiency and high switching frequency, starting a new era in power electronics.
Highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces its latest isolated EiceDRIVER 2L-SRC Compact (1ED32xx) gate driver family in a compact form factor.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its easy-to-design EiceDRIVER X3 Compact (1ED31xx) and the highly flexible EiceDRIVER X3 Enhanced Analog (1ED34xx) and Digital (1ED38xx) gate driver families. Both families now offer variants with superior reinforced isolation for higher application safety and long operating life.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces two new reference boards designed for rotary refrigerator compressors supporting Infineon’s motto “From product thinking to system understanding.” Both boards are turnkey solutions for low power compressors that can be easily copied by customers to build final mass-production application boards.