The design of future power electronic systems is continuously pushed to improve state-of-the-art performance and power density. Supporting this trend, Infineon Technologies AG launches a new Source-Down 3.3 x 3.3 mm² PQFN product family in the 25-150 V classes with Bottom-Side (BSC) and Dual-Side Cooling (DSC) variants.

Aiming at Infineon’s latest AURIX TC4x the hardware support package for MathWorks Simulink^® supports automotive engineers in designing advanced electric vehicles, sensor fusion, and radar signal processing functions, even before silicon is available. With the package, the designers can validate use cases, rapidly and automatically generate the embedded software, and test algorithms.

Infineon Technologies AG has been named a CES^® 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.

Infineon Technologies AG in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C.

Commercial production of integrated circuits using 28 nm technology node began several years ago. As the process technology has matured, market demand for 28 nm products has also increased.

Quantum computers could become a serious threat to the security of documents such as electronic passports before the present decade is over.

Infineon Technologies AG and TSMC today announced the companies are preparing to introduce TSMC’s Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology into Infineon’s next generation AURIX microcontrollers (MCU).

Infineon Technologies AG and Fingerprint Cards AB (STO: FING B, Fingerprints) today announced the signing of a joint development and commercialization agreement of a plug-and-play turnkey solution for biometric payment smart cards. The goal of the cooperation is to make biometric smart card production as simple and easy as producing a standard dual interface payment card.

Infineon Technologies AG recently added EasyPACK 4B to its industry-leading Easy power module family. The lead-type of the new family targets applications in photovoltaic string inverters.

Introduced by the United Nations Economic Commission for Europe (UNECE), the new UN R155 regulation addresses the increasing focus on cybersecurity in connected automobiles.